MP 1,1-5,1 2009 4,1 Single CPU Upgrade: Proper Application of Thermal Grease?

[msh]

I am about to upgrade my CPU to a 6 core but there are conflicting instructions between the Apple MP Tech Guide and other unofficial guides.

The Apple guide says to use a pattern like this:

But others say to use a small drop in the middle of the CPU. Does it matter?

 

[Alex Sanders74]

I am about to upgrade my CPU to a 6 core but there are conflicting instructions between the Apple MP Tech Guide and other unofficial guides.

The Apple guide says to use a pattern like this:


View attachment 843690

But others say to use a small drop in the middle of the CPU. Does it matter?

Just swapped a cpu into a 5.1 recently and followed the exact guide you're showing. Very thin bead as the diagram shows and it's been fine after tightening heatsink screws. Temps are quite good. I'd say use this guide, but others may have their own opinions on this.

Keep the bead thin as too much paste will squish out from the heatsink and make a mess.

 

[orph]

if you use a good thermal paste that is not conductive you can't go to wrong.
I did an 'X' with dots between the legs (4-5 years ago) and never had a problem.
(I suspect I used to much but nothing bad happend )

the important thing is the die is in the center (may be a rectangle which will explain the apple diagram) so as long as thats covered your good to go, the pic you posted looks good to me.

when I did it the first time I was tad scared but now I kind of know you cant relay go to wrong, all the intel dies are centered and not to big

did a serch and found this image of a macpro cpu die (ie under the IHS)

so as long as above that die is covered your good

 

[h9826790]

I am about to upgrade my CPU to a 6 core but there are conflicting instructions between the Apple MP Tech Guide and other unofficial guides.

The Apple guide says to use a pattern like this:


View attachment 843690

But others say to use a small drop in the middle of the CPU. Does it matter?

In most case, doesn't really matter.

 

[flehman]

I applied a slightly less than pea-sized amount of AS-5 to the center and screwed down the heat sink on top. Idle temps are 34-36 C. 4,1 with a single 5690.

 

[zackkmac]

I have a single CPU 5.1 (3.33GHz 6-core) and I did enough to cover the lid in an even thin layer, my temps are pretty low and stable at ~36 degrees Celsius in light tasks. I would imagine the method you posted is fine as long as the die gets a thin, even coat.

 

[Samford]

I too have a single CPU W3680 (3.33GHz 6-core) 5,1 and did a 5mm pea in center and 4 small dots towards each corner and the CPU heat sink sits a 26-28 C in a cool room. Yes I do run my fans a little higher than Apple do. NT-H1 thermal paste used.

 

[MIKX]

I smear both surfaces very lightly using new latex gloves and THEN add a grain of rice sized blob in the middle.