Just in.. from Electronics News
Motorola Volume Ships Low-K MPUs
Online staff -- Electronic News, 6/2/2003
Motorola Inc. has reversed its low-k plans, today announcing volume MPU shipments of low-k insulating dielectric during the metallization process on 0.18-micron SOI, instead of its targeted 0.13-micron node.
Doing so allowed the Texas giant to begin shipping products manufactured at the 0.18 micron SOI process in Q1. Motorola still has plans to ship at 0.13-micron later this year, the company said.
Products manufactured at 0.18-micron, meanwhile, run up to 20 percent faster and at lower power than those made without it while maintaining high yields and reliability, Motorola claimed, withholding specifics. So far, the process has been applied to Motorola's PowerPC microprocessor products including the G4 PowerPC processor, Motorola's MPC 7455 and the recently introduced 7457.
"Motorola has developed several novel approaches to overcome the technical challenges associated with successfully integrating a low-k dielectric into its metallization process," Suresh Venkatesan, director of CMOS development in Motorola's Digital DNA labs, said in a statement. "The process utilizes a hydrogenated silicon oxycarbide (SICOH) film. While many semiconductor manufacturers are researching ways to implement SICOH-based solutions, Motorola was among the first to get volume microprocessor production to the marketplace using this SICOH process."
Motorola produced these products on 200mm wafers at its MOS-13 wafer fab in Austin.
I thought the 7457 was on 0.13